| 摘要 |
PROBLEM TO BE SOLVED: To form a conductive layer with a good coverage in the vicinity of a bottom face part of a through-hole, and to form through wiring with improved electrical stability without contact failures, without increase in the number of steps and cost.SOLUTION: A method of manufacturing a through wiring board includes: a first step of forming a conductive part on a semiconductor substrate; a second step of forming a through-hole on the semiconductor substrate; a third step of forming a second insulating layer on at least an inner wall surface and a bottom face of the through-hole; a fourth step of removing a part located at the bottom face of the through-hole, of the two insulating layers, to expose the conductive part; and a fifth step of forming a conductive layer electrically connected with the conductive part, on the second insulating layer. At the fourth step, the second insulating layer, the first insulating layer, and a part of the conductive part are sequentially etched, and a first by-product generated due to the etching is deposited over the bottom face part of the through-hole and the inner wall surface part located in the vicinity of the bottom face part to form a taper part in such a curved shape that a lower part side of the through-hole becomes thick and becomes thinner toward an upper part of the through-hole. At the fifth step, to the bottom face part of the through-hole, the conductive layer is formed on the taper part formed on the second insulating layer. |
