发明名称 Optical sensor chip device and corresponding production method
摘要 An optical sensor chip device and a corresponding production method. The optical sensor chip device includes a substrate having a front side and a rear side; at least one first optical sensor chip for acquiring a first optical spectral range, the chip being attached to the substrate; and a first sealed cavern fashioned above an upper side of the first optical sensor chip. The first optical sensor chip is situated on a first side of the first cavern, and a first optical device is situated on an opposite, second side of the first cavern.
申请公布号 US9275974(B2) 申请公布日期 2016.03.01
申请号 US201414177722 申请日期 2014.02.11
申请人 ROBERT BOSCH GMBH 发明人 Kaschner Axel;Krueger Michael
分类号 H01L25/04;H01L25/00;H01L31/0232;H01L25/065;H01L27/146 主分类号 H01L25/04
代理机构 Kenyon & Kenyon LLP 代理人 Kenyon & Kenyon LLP
主权项 1. An optical sensor chip device, comprising: a substrate having a front side and a rear side; at least one first optical sensor chip which is attached to the substrate to acquire a first optical spectral range; a first sealed cavern fashioned above an upper side of the first optical sensor chip, wherein the first optical sensor chip is situated on a first side of the first cavern, and a first optical device is situated on an opposite, second side of the first cavern; and a cap fashioned on the upper side of the optical sensor chip, the cap enclosing a hollow space having a vacuum.
地址 Stuttgart DE