发明名称 |
Optical sensor chip device and corresponding production method |
摘要 |
An optical sensor chip device and a corresponding production method. The optical sensor chip device includes a substrate having a front side and a rear side; at least one first optical sensor chip for acquiring a first optical spectral range, the chip being attached to the substrate; and a first sealed cavern fashioned above an upper side of the first optical sensor chip. The first optical sensor chip is situated on a first side of the first cavern, and a first optical device is situated on an opposite, second side of the first cavern. |
申请公布号 |
US9275974(B2) |
申请公布日期 |
2016.03.01 |
申请号 |
US201414177722 |
申请日期 |
2014.02.11 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
Kaschner Axel;Krueger Michael |
分类号 |
H01L25/04;H01L25/00;H01L31/0232;H01L25/065;H01L27/146 |
主分类号 |
H01L25/04 |
代理机构 |
Kenyon & Kenyon LLP |
代理人 |
Kenyon & Kenyon LLP |
主权项 |
1. An optical sensor chip device, comprising:
a substrate having a front side and a rear side; at least one first optical sensor chip which is attached to the substrate to acquire a first optical spectral range; a first sealed cavern fashioned above an upper side of the first optical sensor chip, wherein the first optical sensor chip is situated on a first side of the first cavern, and a first optical device is situated on an opposite, second side of the first cavern; and a cap fashioned on the upper side of the optical sensor chip, the cap enclosing a hollow space having a vacuum. |
地址 |
Stuttgart DE |