Substrate processing with rapid temperature gradient control

摘要

A substrate processing chamber comprises an electrostatic chuck comprising a ceramic puck having a substrate receiving surface and an opposing backside surface. In one version, the ceramic puck comprises a thickness of less than 7 mm. An electrode is embedded in the ceramic puck to generate an electrostatic force to hold a substrate, and heater coils in the ceramic puck allow independent control of temperatures at different heating zones of the puck. A chiller provides coolant to coolant channels in a base below the ceramic puck. A controller comprises temperature control instruction sets which set the coolant temperature in the chiller in relation prior to ramping up or down of the power levels applied to the heater.

主权项

1. A substrate support assembly comprising:
(a) a ceramic puck comprising a substrate receiving surface having a plurality of ports to provide a heat transfer gas to the surface, central and peripheral portions, and an opposing backside surface, the ceramic puck comprising (i) an electrode embedded therein to generate an electrostatic force to retain a substrate placed on the substrate receiving surface, and (ii) a heater embedded therein to heat the substrate, the heater comprising a first heater coil located at the peripheral portion of the ceramic puck and a second heater coil located at the central portion of the ceramic puck; (b) a coolant base comprising a coolant channel to circulate coolant therethrough, the coolant channel comprising an inlet and terminus; (c) a compliant layer bonding the backside surface of the ceramic puck to the coolant base; and (d) a controller configured to (i) independently apply different electrical power levels to the first and second heater coils, and control the temperature and flow rate of coolant passed through the coolant channel of the coolant base to increase a coolant temperature of the coolant to a higher level prior to ramping up the power level applied to the first and second heater coils in the ceramic puck, or decrease the coolant temperature of the coolant to a lower level prior to ramping down the power level applied to the first and second heater coils in the ceramic puck, (ii) receive temperature signals from a temperature sensor; and (iii) serve as a feedback control loop to adjust the power applied to the heater coils and the flow of fluid through the coolant channel of the coolant base in response to the temperature signals from the temperature sensor.