Wire bonds for electronics

摘要

A circuit element includes a semiconductor chip and a wire for connecting between the semiconductor chip and an additional circuit element. A plurality of wire bond connections electrically connect the wire and the semiconductor chip. The plurality of wire bond connections can be disposed on a surface of the semiconductor chip and on a surface of the wire.

主权项

1. A circuit element, comprising:
a semiconductor chip; a wire for connecting between the semiconductor chip and an additional circuit element; and a plurality of wire bond connections electrically connecting the wire and the semiconductor chip, wherein the wire is a helical shaped wire that electrically connects to the semiconductor chip through the plurality of wire bond connections.