Multi-chip socket

摘要

A multi-chip socket including multiple cavities. The multiple cavities include support surfaces. The support surfaces may be disposed at different heights relative to a reference plane. A first thermal interface is to thermally contact a top surface of the first component, and a second thermal interface is to thermally contact a top surface of the second component.

主权项

1. An apparatus comprising:
a multi-chip socket comprising:
a first cavity having a first support surface to support a first component including a first chip, the first support surface arranged to contact and support the first chip, and the first support surface being at a first height with respect to a reference plane;a second cavity electrically coupled to the first cavity and having a second support surface to support a second component including a second chip, the second support surface arranged to contact and support the second chip, and the second support surface being at a second, different height with respect to the reference plane;a first thermal interface to thermally contact a top surface of the first component;a second thermal interface to thermally contact a top surface of the second component; and a heat extraction device arranged to thermally connect to a top surface of the first thermal interface and a top surface of the second thermal interface, the top surfaces of the first thermal interface and the second thermal interface being coplanar.