| 发明名称 | Printed wiring board and information processing apparatus | ||
| 摘要 | A printed wiring board having a land for surface-mounting of an electronic component, includes the land having a pair of land pieces arranged in an opposing manner, and each of the land pieces including a plurality of land portions having widths different from each other, and a coupling portion partially coupling a boundary portion between a pair of adjacent ones of the land portions. | ||
| 申请公布号 | US9277648(B2) | 申请公布日期 | 2016.03.01 |
| 申请号 | US201414570290 | 申请日期 | 2014.12.15 |
| 申请人 | FUJITSU LIMITED | 发明人 | Hamao Shotaro;Tamura Yoshiaki;Kurosawa Toshiki |
| 分类号 | H05K1/11 | 主分类号 | H05K1/11 |
| 代理机构 | Westerman, Hattori, Daniels & Adrian, LLP | 代理人 | Westerman, Hattori, Daniels & Adrian, LLP |
| 主权项 | 1. A printed wiring board having a land for surface-mounting of an electronic component, comprising: the land having a pair of land pieces arranged in an opposing manner, and each of the land pieces including a plurality of land portions having widths different from each other, and a coupling portion partially coupling a boundary portion between a pair of adjacent ones of the land portions, wherein in the boundary portion between the pair of land portions, a plurality of resist portions for suppressing a flow of solder between the pair of land portions are arranged along a width direction of the land pieces, and the coupling portion is disposed between adjacent ones of the resist portions. | ||
| 地址 | Kawasaki JP | ||