| 主权项 |
1. A focal plane array (FPA), comprising:
a package body extending continuously between an upper surface and a lower surface to define outer sides, the package body having a cavity formed therein to define inner sidewalls and an inner surface extending between the inner sidewalls; a dielectric attachment material having a first surface disposed directly against the inner surface of the package body and a second surface disposed directly against a read out integrated circuit (ROIC) comprising a circuit side having circuitry thereon; a photodiode array (PDA) comprising circuitry including a plurality of photodiodes; and a conductor interposed between the PDA and the ROIC, wherein the conductor electrically couples circuitry on the PDA to circuitry on the ROIC; an optically transparent lid including an inner surface extending continuously between a pair of opposing outer edges, the outer edges attached to the outer sides of package body via a hermetic sealing material interposed between the optically transparent lid and the outer sides, wherein the package body and the lid define an interior of the FPA, and wherein the PDA and the ROIC are sealed within the interior of the FPA such that the inner surface of the optically transparent lid extends beyond the PDA and the ROIC; and a plurality of conductive traces on an interior surface of the lid, wherein the circuitry on the ROIC is electrically coupled to the plurality of conductive traces on the interior surface of the lid, the plurality of conductive traces including a first trace and an opposing second trace, wherein the dielectric layer is interposed between the first and second traces so as to physically attach the optically transparent lid to the PDA. |
