Low cost high frequency device package and methods

摘要

A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.

主权项

1. An electrical component package, comprising:
a package having a plurality of leads and a base; a structure attached to said base, the structure having at least one site; and at least one waveguide interconnect connecting the at least one site on said structure to at least one of said plurality of leads of the package, the waveguide interconnect comprising a shield, wherein the shield has a connection to a package lead ground, wherein two leads adjacent the at least one of said plurality of leads connected to the waveguide interconnect each comprises a ground lead, wherein the two ground leads and the at least one of said plurality of leads attached to the waveguide interconnect are shaped to form a transition from a planar transmission line to a coaxial transmission line, with an impedance of the waveguide interconnect being matched to an impedance of the at least one of said plurality of leads.