| 发明名称 | Semiconductor device and semiconductor package having a plurality of differential signal balls | ||
| 摘要 | A semiconductor device includes a substrate, a sealing portion, a controller, a semiconductor chip, and a plurality of differential signal balls. The substrate has a first surface and a second surface positioned on a side opposite to the first surface. The sealing portion is formed on the first surface of the substrate. The controller is covered with the sealing portion. The semiconductor chip is electrically connected to the controller, and is covered with the sealing portion. The plurality of differential signal balls are formed on the second surface of the substrate. At least some of the plurality of differential signal balls are arranged substantially parallel to one side of the substrate. | ||
| 申请公布号 | US9275947(B2) | 申请公布日期 | 2016.03.01 |
| 申请号 | US201414190775 | 申请日期 | 2014.02.26 |
| 申请人 | Kabushiki Kaisha Toshiba | 发明人 | Ozawa Isao;Maeda Isao;Kudo Yasuo;Nagai Koichi;Murakami Katsuya;Tanimoto Akira |
| 分类号 | H01L23/00;H01L23/50;H01L23/498;H01L25/065;H01L23/367;H01L23/31;H01L23/66;H01L25/18 | 主分类号 | H01L23/00 |
| 代理机构 | Patterson & Sheridan, LLP | 代理人 | Patterson & Sheridan, LLP |
| 主权项 | 1. A semiconductor device comprising: a substrate having a first surface and a second surface positioned on a side opposite to the first surface; a sealing portion formed on the first surface of the substrate; a controller covered with the sealing portion; a semiconductor chip electrically connected to the controller and covered with the sealing portion; a ground ball formed on the second surface of the substrate; and a plurality of differential signal balls formed on the second surface of the substrate, wherein at least some of the plurality of differential signal balls are arranged substantially parallel to one side of the substrate, and the ground ball is positioned between two adjacent differential signal balls. | ||
| 地址 | Tokyo JP | ||