Power device having reduced thickness

摘要

An electronic device includes at least one chip and an insulating body embedding the chip. The electronic device further includes a heat-sink in contact with the chip. The heat-sink includes a plate having a first thickness. A recess is provided in the plate that defines a central portion of the plate having a second thickness less than the first thickness. The chip is mounted to the central region of the heat-sink within the recess. The insulating body includes a surface, such as a mounting surface, including an opening exposing at least a portion of the heat-sink. The device may further include a reophore extending through a side surface of the insulating body, that reophore being in contact with the heat sink.

主权项

1. An electronic device, comprising:
at least one chip wherein at least one electronic component is integrated, the at least one chip comprising a first conduction terminal on a first surface of the chip, and a second conduction terminal and a third conduction terminal on a second surface of the chip opposite the first surface; a first heat-sink formed by a solid plate consisting of an electrically conductive material, the solid plate provided with at least one recess in a surface that defines a first portion of the solid plate having a first thickness and a second portion of the solid plate having a second thickness less than the first thickness; wherein the first surface with the first conduction terminal of said at least one chip is mounted to a bottom surface of the at least one recess for dissipating heat generated by said at least one electronic component towards a mounting surface configured to be mounted on a board; wherein the first portion of the solid plate completely surrounds a peripheral edge of, said at least one chip housed within said at least one recess; a second heat-sink formed of an electrically conductive material for dissipating the heat generated by said at least one electronic component towards a free surface opposite the mounting surface, the second heat-sink contacting the second conduction terminal on the second surface and extending over at least one portion of the third conduction terminal, the second heat-sink comprising at least one further recess for insulating the third conduction terminal from the second heat-sink; and an insulating body encapsulating the at least one chip, the first heat-sink, and the second heat-sink, wherein the insulating body is made of a non-electrically conductive material.