Circuit device and method of manufacturing the same

摘要

In a hybrid integrated circuit device of the present invention, leads are fixedly attached on the upper surface of a circuit board. The lead includes an island portion, a slope portion, and a lead portion. A transistor and a diode are mounted on the upper surface of the island portion. Electrodes provided on the upper surfaces of the transistor and the diode are connected to a bonding portion through a fine metal wire. The bonding portion of the lead is disposed at a higher position than the island portion. Thus, the fine metal wires connected to the bonding portion are separated from each other.

主权项

1. A hybrid circuit device comprising:
a circuit board disposed entirely within a recessed potion of the hybrid circuit device with an insulating resin surrounding the circuit board on at least one side; a plurality of leads, each of the leads comprising an island portion of a plurality of island portions attached to an upper surface of the circuit board, a bonding portion elevated from the island portion, and a slope portion extending obliquely so as to connect the island portion and the bonding portion; a plurality of circuit elements mounted on the island portions of the plurality of island portions so as to be connected to corresponding bonding portions through wirings wherein the plurality of circuit elements are mounted on the plurality of island portions so as to be connected to corresponding bonding portions through wirings wherein one of the plurality of leads is a first input lead connected to a positive electrode side of a direct-current power source, another of the plurality of leads is a second input lead connected to a negative electrode side of the direct-current power source, and yet another of the plurality of leads is an output lead through which alternating-current power obtained by converting direct-current power inputted through the first input lead and the second input lead is outputted; and a first circuit element and a second circuit element disposed on an upper surface of said circuit board between said insulating resin and said circuit board electrically connected to a first lead via a first metal wire that is disposed within the insulating resin and at least one of the first and second circuit elements connected to one of a second lead or a third circuit element via a second metal wire.