Band pass filter for 2.5D/3D integrated circuit applications

摘要

Some embodiments relate to a device and method for a band pass filter with a reduced cost, area penalty, and manufacturing complexity relative to current solutions. An integrated passive device chip includes a plurality of capacitors embedded in a common molding compound along with a transceiver chip. The integrated passive device chip and the transceiver chip are also arranged within a polymer package. An ultra-thick metallization layer is disposed within the polymer package and configured to couple the integrated passive device chip to the transceiver chip. The ultra-thick metallization layer also forms a plurality of transmission lines, wherein the combined integrated passive device chip and transmission lines form a band pass filter with improved frequency response, noise immunity, and cost and area as compared to conventional solutions.

主权项

1. A filter, comprising:
a polymer package and common molding compound that collectively form a body; a passive device chip disposed within the body, and comprising a plurality of capacitors; a transceiver chip disposed within the body, and comprising a plurality of active devices; and a plurality of transmission lines, which electrically connect the passive device chip and the transceiver chip to a solder bump or pin arranged on an outer surface of the body; wherein the polymer package is arranged over respective upper surfaces of the passive device chip, the transceiver chip, and the common molding compound; wherein a first subset of the plurality of capacitors are connected in series along a path extending continuously between an input and an output of the filter, and wherein respective capacitors are coupled by respective nodes on the path; and wherein a second subset of the plurality of capacitors are connected in parallel between the respective nodes and a ground terminal.