发明名称 Hot runner system sealing arrangement
摘要 A sealing arrangement between hot runner components includes a sealing component positioned between a first hot runner component and a second hot runner component having a molding material channel extending therebetween. The sealing component includes an opening through which the molding material channel extends. The sealing component is received in a bore in the second hot runner component such that a portion of the sealing component projects beyond the second hot runner component to create a gap between the first hot runner component and the second hot runner component. The sealing component has a hardness that is greater than a hardness of the second hot runner component and less than a hardness of the first hot runner component. Further, the sealing component has a coefficient of thermal expansion that is proximate to a coefficient of thermal expansion of the second hot runner component.
申请公布号 US9272455(B2) 申请公布日期 2016.03.01
申请号 US201514700129 申请日期 2015.04.29
申请人 Mold-Masters (2007) Limited 发明人 Tabassi Payman
分类号 B29C45/22;B29C45/74;B29L31/00;B29C45/27 主分类号 B29C45/22
代理机构 Medler Ferro PLLC 代理人 Medler Ferro PLLC
主权项 1. A hot runner assembly comprising: a first hot runner component and a second hot runner component having a molding material channel extending therebetween; and a sealing component positioned between the first hot runner component and the second hot runner component, and having an opening through which the molding material channel extends, wherein the sealing component is received in a bore in the second hot runner component such that a portion of the sealing component projects beyond the second hot runner component to create a gap between the first hot runner component and the second hot runner component, wherein the sealing component has a hardness that is greater than a hardness of the second hot runner component and less than a hardness of the first hot runner component, and wherein the sealing component has a coefficient of thermal expansion that is proximate to a coefficient of thermal expansion of the second hot runner component.
地址 Georgetown, Ontario CA