| 摘要 |
Disclosed are an integrated wafer measurement system and a providing method thereof. The integrated wafer measurement system according to an embodiment of the present invention includes a sensor part which includes a pair of sensors which individually comprise a first sensor which measures a first displacement from the upper part of a transfer part through which a wafer is transferred to the upper surface of the wafer, and a second sensor which is practically perpendicular to the first sensor and measures a second displacement from the lower part of the transfer part to the lower surface of the wafer; and a control part which uses at least one from the first displacement and the second displacement measured by the sensor part, and detects at least one among a thickness variation, a warpage, and a distortion of the wafer. |
