| 摘要 |
A coreless package substrate having dual side solder resist layers is disclosed. The coreless package substrate has a top side and a bottom side facing the top side and includes a single build-up structure formed of at least one insulating layer, at least one via, and at least one conductive layer. The coreless package substrate also includes a bottom plurality of contact pads on the bottom side, and a top plurality of contact pads on the top side. A bottom solder resist layer is arranged on the bottom side, and a top solder resist layer is arranged on the top side. The concept of dual side solder resist is extended to a package with an interconnect bridge with C4 interconnection pitch over a wide range. |
