| 摘要 |
FIELD: information technology.SUBSTANCE: smart card comprises, located in a depression on the card, an external connector formed from an insulating substrate and a plurality of external metal contact pads located on the outer surface of the insulating substrate. A plurality of internal metal contact pads are located under the external connector and are respectively aligned with the plurality of external metal contact pads, which are respectively electrically connected to the plurality of internal metal contact pads by a plurality of metal elements, each at least in a part formed by a solder material and which cross the said insulating substrate through corresponding openings with a diameter greater than 0.2 mm to form connection bridges between the back surfaces of the plurality of external metal contact pads and the plurality of internal metal contact pads.EFFECT: high reliability.16 cl, 34 dwg |
