发明名称 DICING SHEET
摘要 This dicing sheet (1) comprises a substrate (2) and a pressure-sensitive-adhesive layer (3) laminated to at least one surface of said substrate (2). Said pressure-sensitive-adhesive layer (3) is 2 to 20 µm thick and is made from a pressure-sensitive-adhesive composition that contains both an acrylic polymer (A) and a polyfunctional acrylate energy-ray-polymerizable compound (B). Said polyfunctional acrylate energy-ray-polymerizable compound (B) contains 0.004 to 0.009 moles of polymerizable functional groups per gram and constitutes 20% to 65% of the combined mass of the acrylic polymer (A) and the polyfunctional acrylate energy-ray-polymerizable compound (B). When adhered to a high-surface-roughness workpiece such as a semiconductor package, this dicing sheet (1) exhibits sufficient adhesive strength before energy-ray exposure, also exhibits appropriate adhesive strength after energy-ray exposure, and is resistant to the formation of pressure-sensitive-adhesive aggregates.
申请公布号 SG11201600047X(A) 申请公布日期 2016.02.26
申请号 SGX11201600047 申请日期 2014.07.03
申请人 LINTEC CORPORATION 发明人 NISHIDA, TAKUO;KOMA, YOSUKE
分类号 H01L21/301;C09J7/02;C09J133/00 主分类号 H01L21/301
代理机构 代理人
主权项
地址