Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density of less than 0.5 g/cc and composed of a thermoset polyurethane material. A plurality of closed cell pores is dispersed in the thermoset polyurethane material.
申请公布号
SG11201600242P(A)
申请公布日期
2016.02.26
申请号
SG11201600242P
申请日期
2014.07.17
申请人
NEXPLANAR CORPORATION
发明人
HUANG, PING;ALLISON, WILLIAM C.;FRENTZEL, RICHARD;LEFEVRE, PAUL ANDRE;KERPRICH, ROBERT;SCOTT, DIANE