| 摘要 |
The present invention relates to semiconductor packages and, more particularly, to a multi-chip package produced by stacking semiconductor packages. According to an embodiment of the present invention, the multi-chip package is produced by having ball grid array (BGA) type packages stacked on one another. According to an embodiment, the multi-chip package comprises: a first printed circuit board (PCB), a first BGA package mounted on the first PCB, a second PCB, and a second BGA package mounted on the second PCB. |
