| 发明名称 |
WAFER DEBONDING USING MID-WAVELENGTH INFRARED RADIATION ABLATION |
| 摘要 |
Methods are provided to form adhesive materials that are used to temporarily bond handler wafers to device wafers, and which enable mid-wavelength infrared laser ablation release techniques to release handler wafers from device wafers. |
| 申请公布号 |
SG11201600462V(A) |
申请公布日期 |
2016.02.26 |
| 申请号 |
SG11201600462V |
申请日期 |
2014.07.29 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DANG, BING;KNICKERBOCKER, JOHN U.;TSANG, CORNELIA KANG-I |
| 分类号 |
H01L21/02;H01L21/683 |
主分类号 |
H01L21/02 |
| 代理机构 |
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