FLEXIBLE METALLIC GLASS SUBSTRATE WITH HIGH RESILIENCE, MANUFACTURING METHODE OF THE SAME AND ELECTRONIC DEVICE BY USING THE SAME

摘要

The present invention relates to a flexible substrate for an electronic element, and more specifically, to a flexible amorphous alloy substrate with high resilience which is made of an amorphous alloy. The amorphous alloy is a commercial alloy-based amorphous alloy system with high resilience which is suitable for continuous mass production, and can be one material selected among Mg- and Ca-based amorphous alloy in group IIA, Al-based amorphous alloy in group IIIA, and Ti-, Zr-, Hf-, Fe-, Co-, Ni-, and Cu-based amorphous alloy which are transition metals. Preferably, a crystallization temperature which determines a process allowable temperature is 200°C or higher. And the substrate preferably has a resilience value of 1.5 MJ/m^3 or higher. A coefficient of thermal expansion (CTE) is within a small range of 1-20 ppm/°C to improve an interfacial property with an electronic element. The present invention uses a high-resilience amorphous alloy as a material for the flexible substrate to resolve disadvantages of a conventional flexible substrate of a polymer material and a metallic material and retain advantages only.