Embodiments include curable compositions including an epoxy resin and a hardener component including a polymer having first constitutional unit, a second constitutional unit, and a third constitutional unit, where the epoxy group to the second constitutional unit has a molar ratio in a range of 0.5:1 to 5:1. Embodiments include prepregs that include a reinforcement component and the curable composition and an electrical laminate formed with the curable composition.
申请公布号
SG11201600573V(A)
申请公布日期
2016.02.26
申请号
SG11201600573V
申请日期
2014.07.24
申请人
BLUE CUBE IP LLC
发明人
YE, SIMON;XIAO, TIANHUI;CHEN, HONGYU;MULLINS, MICHAEL J.;CAI, YU;XIONG, JIAWEN;STORER, JOEY W.;WILSON, MARK B.;GONG, FRANK Y.