ADHESIVE COMPOSITION, ADHESIVE SHEET, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

摘要

An adhesive composition includes an acrylic polymer (A) having a weight-average molecular weight (Mw) of 350,000 or higher obtained by polymerizing an acrylic monomer by living radical polymerization using an organotellurium-containing compound as the polymerization initiator, an epoxy thermosetting resin (B), and a thermosetting agent (C). The adhesive composition is capable of joining with sufficient adhesive strength and capable of achieving high package reliability in a semiconductor device.