| 摘要 |
THE PRESENT INVENTION PROVIDES A HEAT-CURABLE RESIN COMPOSITION HAVING EXCELLENT FLUIDITY AND REALIZING MOISTURE-RESISTANCE RELIABILITY SUITABLE FOR RECENT ELECTRONIC COMPONENT-RELATED MATERIALS AND HIGH FLAME RETARDANCY IN A HALOGEN-FREE STATE FOR HARMONY WITH THE ENVIRONMENT, A CURED PRODUCT THEREOF, A SEMICONDUCTOR ENCAPSULATING MATERIAL USING THE COMPOSITION, AND A PHENOL RESIN AND EPOXY RESIN WHICH GIVE THESE PERFORMANCES. THE HEAT-CURABLE RESIN COMPOSITION INCLUDES, AS ESSENTIAL COMPONENTS, AN EPOXY RESIN (A) AND A PHENOL RESIN (B), THE PHENOL RESIN (B) HAVING A PHENOL RESIN STRUCTURE HAVING, AS A BASIC SKELETON, A STRUCTURE IN WHICH A PLURALITY OF PHENOLIC HYDROXYL GROUP-CONTAINING AROMATIC SKELETONS (PH) ARE BONDED TO EACH OTHER THROUGH AN ALKYLIDENE GROUP OR A METHYLENE GROUP HAVING AN AROMATIC HYDROCARBON STRUCTURE, AND AN AROMATIC NUCLEUS OF THE PHENOL RESIN STRUCTURE HAS A NAPHTHYLMETHYL GROUP OR AN ANTHRYLMETHYL GROUP. (FIG. 1) |
