ELECTRONIC PACKAGING DEVICE, AND MANUFACTURING METHOD AND PACKAGING EFFECT DETECTION METHOD THEREFOR

摘要

An electronic packaging device, and a manufacturing method and a packaging effect detection method therefor. The electronic packaging device comprises an underlayer substrate and a packaging substrate that are arranged opposite to each other and a sealant arranged between the underlayer substrate and the packaging substrate. The electronic packaging device also comprises an electronic functional layer that is arranged at one side of the underlayer substrate facing the packaging substrate, and a composite thin film layer and a test lead that are arranged at one side of the packaging substrate facing the underlayer substrate. The composite thin film layer comprises a hygroscopic thin film close to the packaging substrate and a piezoelectric thin film that is coated on the surface of the hygroscopic thin film. The piezoelectric thin film is in contact with one end of the test lead. The other end of the test lead passes through the sealant and extends to the outside of the electronic packaging device.