| 发明名称 |
HYBRID CARBON-METAL INTERCONNECT STRUCTURES |
| 摘要 |
Embodiments of the present disclosure are directed towards techniques and configurations for hybrid carbon-metal interconnect structures in integrated circuit assemblies. In one embodiment, an apparatus includes a substrate, a metal interconnect layer disposed on the substrate and configured to serve as a growth initiation layer for a graphene layer and the graphene layer, wherein the graphene layer is formed directly on the metal interconnect layer, the metal interconnect layer and the graphene layer being configured to route electrical signals. Other embodiments may be described and/or claimed. |
| 申请公布号 |
US2016056384(A1) |
申请公布日期 |
2016.02.25 |
| 申请号 |
US201514931764 |
申请日期 |
2015.11.03 |
| 申请人 |
INTEL CORPORATION |
发明人 |
Barth Hans-Joachim |
| 分类号 |
H01L51/00;H01L21/48;H01L23/498 |
主分类号 |
H01L51/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus comprising:
a substrate; a metal interconnect layer disposed on the substrate and configured to serve as a growth initiation layer for a graphene layer; and the graphene layer, wherein the graphene layer is formed directly on the metal interconnect layer, the metal interconnect layer and the graphene layer being configured to route electrical signals. |
| 地址 |
SANTA CLARA CA US |
