| 发明名称 |
OPTOELECTRONIC SEMICONDUCTOR COMPONENT |
| 摘要 |
An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas, a surface at a top side of the semiconductor chip, and a surface at a bottom side of the semiconductor chip; a shaped body having a surface at a top side of the shaped body and a surface at an underside of the shaped body; at least one plated-through hole including an electrically conductive material; and an electrically conductive connection electrically conductively connected to the semiconductor chip and the plated-through hole, wherein the side areas of the optoelectronic semiconductor chip are covered by the shaped body, and the surface at the top side and/or the surface at the bottom side of the optoelectronic semiconductor chip are completely free of the shaped body. |
| 申请公布号 |
US2016056343(A1) |
申请公布日期 |
2016.02.25 |
| 申请号 |
US201514931246 |
申请日期 |
2015.11.03 |
| 申请人 |
OSRAM Opto Semiconductors GmbH |
发明人 |
Weidner Karl;Wirth Ralph;Kaltenbacher Axel;Wegleiter Walter;Barchmann Bernd;Wutz Oliver;Marfeld Jan |
| 分类号 |
H01L33/48;H01L31/0232;H01L33/56;H01L31/0203;H01L33/62;H01L33/60 |
主分类号 |
H01L33/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An optoelectronic semiconductor component comprising:
an optoelectronic semiconductor chip having side areas, a surface at a top side of the semiconductor chip, and a surface at a bottom side of the semiconductor chip; a shaped body having a surface at a top side of the shaped body and a surface at an underside of the shaped body; at least one plated-through hole comprising an electrically conductive material; and an electrically conductive connection electrically conductively connected to the semiconductor chip and the plated-through hole, wherein the side areas of the optoelectronic semiconductor chip are covered by the shaped body, and the surface at the top side and/or the surface at the bottom side of the optoelectronic semiconductor chip are completely free of the shaped body. |
| 地址 |
Regensburg DE |
