PCB INTER-LAYER CONDUCTIVE STRUCTURE APPLICABLE TO LARGE-CURRENT PCB

摘要

For producing an inter-layer conductive structure of a circuit board, an insulating layer, a first conductive layer, a second conductive layer and an electric contact material are provided, wherein the insulating layer includes at least a conductive hole therein. The electric contact material is inserted into the conductive hole of the insulating layer to form a conductive plug, and the first and second conductive layers are laminated to opposite surfaces of the insulating layer, respectively. After lamination, the conductive plug has two ends thereof in electric contact with the first conductive layer and the second conductive layer, respectively.

主权项

1. A process for producing an inter-layer conductive structure of a circuit board, comprising steps of:
a) providing a first insulating layer, a first conductive layer, a second conductive layer and a first electric contact material, wherein the first insulating layer includes at least a first conductive hole therein; b) inserting the first electric contact material into the first conductive hole of the first insulating layer to form a first conductive plug; c) laminating the first conductive layer onto a first surface of the first insulating layer; and d) laminating the second conductive layer onto a second surface of the first insulating layer; wherein after the laminating steps c) and d) are completed, the first conductive plug has two ends thereof in electric contact with the first conductive layer and the second conductive layer, respectively.