| 发明名称 |
Packages Having Integrated Devices and Methods of Forming Same |
| 摘要 |
An embodiment device package includes a discrete device, a first connector on a bottom surface of the discrete device, and a second connector on a top surface of the discrete device. The first connector bonds the discrete device to a first package component, and the second connector bonds the discrete device to a second package component. |
| 申请公布号 |
US2016056100(A1) |
申请公布日期 |
2016.02.25 |
| 申请号 |
US201414463396 |
申请日期 |
2014.08.19 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yeh Chao-Yang |
| 分类号 |
H01L23/498;H01L25/00;H01L21/48;H01L21/56;H01L23/31;H01L25/07 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A device package comprising:
a discrete device; a first connector on a bottom surface of the discrete device, wherein the first connector bonds the discrete device to a first package component; and a second connector on a top surface of the discrete device, wherein the second connector bonds the discrete device to a second package component. |
| 地址 |
Hsin-Chu TW |
