SOLDER FLOW-IMPEDING PLUG ON A LEAD FRAME

摘要

Embodiments described herein relate to a packaged component including a lead frame and a non-conductive plug disposed between two or more adjacent sections of the lead frame. The plug is composed of a non-conductive material functions to impede the flow of solder along edges of the two or more adjacent sections during second level solder reflow events that occur after encapsulation of the packaged component. The plug includes a main portion disposed within a space between the two or more adjacent sections, and one or more overlap portions extending from the main portion. The one or more overlap portions are disposed on an internal surface of at least one of the two or more adjacent sections. At least one component is mounted on one of the plurality of sections of the lead frame.

主权项

1. A packaged component comprising:
a lead frame having a plurality of electrically isolated sections of conductive material; a non-conductive plug disposed between two or more adjacent sections of the lead frame, wherein the plug is composed of a non-conductive material and functions to impede the flow of solder during second level solder reflow events that occur after encapsulation of the packaged component, wherein the plug includes:
a main portion disposed within a space between the two or more adjacent sections andone or more overlap portions extending from the main portion, the one or more overlap portions disposed on an internal surface of at least one of the two or more adjacent sections; and at least one component mounted on one of the plurality of sections of the lead frame.