Method of Manufacturing a Package-on-Package Type Semiconductor Package

摘要

A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.

主权项

1. A method of manufacturing a semiconductor package, the method comprising:
attaching an array of known-good package substrates to a carrier; attaching a respective known-good semiconductor die to a respective top surface of each package substrate of the array of package substrates; forming a respective stacking terminal attached to a respective perimeter region of each package substrate of the array of package substrates and outside a footprint of the respective attached semiconductor die; encapsulating the array of package substrates, the semiconductor dies, and the stacking terminals in an encapsulating material; thinning the encapsulating material to expose a respective upper end of each of the stacking terminals; forming a respective interposer for each package substrate of the array of package substrates on an upper surface of the encapsulating material and electrically connected to the respective stacking terminal. removing the encapsulated package substrates, semiconductor dies, and stacking terminals from the carrier; and attaching a respective interconnection structure to each of the encapsulated package substrates on a side opposite the respective semiconductor die.