| 摘要 |
Disclosed is a chip packaging module. The chip packaging module comprises a first chip and at least one second chip. One side of the first chip adjacent to the front surface is provided with a first bonding pad. The at least one second chip is disposed on the rear side of the first chip. Each second chip is provided with a second bonding pad. The first bonding pad of the first chip is connected to the second bonding pad of the second chip by means of a rewiring layer. According to the chip packaging module in the present invention, by arranging the second chip at the rear side of the first chip, connecting the first bonding pad to the second bonding pad by means of a rewiring layer, and carrying out a rewiring technology on the surfaces of multiple chips, a lead of a front-face bonding pad of a fingerprint identification chip is skillfully wound to the back face for interconnection, so that an induction region at the front surface of the chip can be in full contact with a human body. In addition, the multi-chip rewiring technology can also significantly reduce the interconnection distance among chips and improve the communication efficiency among the chips. |
