发明名称 |
PLASMA UNIFORMITY CONTROL BY ARRAYS OF UNIT CELL PLASMAS |
摘要 |
The present invention provides an apparatus having a plasma profile control plate disposed in a plasma processing chamber so as to locally alter plasma density to provide uniform plasma distribution across a substrate surface during processing. In one embodiment, a process kit includes a plate configured to be disposed in a plasma processing chamber, a plurality of apertures formed therethrough, the apertures configured to permit processing gases to flow through the plate, and an array of unit cells including at least one aperture formed in the plate, wherein each unit cell has an electrode assembly individually controllable relative to electrode assemblies disposed in at least two other unit cells. |
申请公布号 |
US2016053376(A1) |
申请公布日期 |
2016.02.25 |
申请号 |
US201414489398 |
申请日期 |
2014.09.17 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
NAM Sang Ki;CHO Tae Seung;GODET Ludovic;NEMANI Srinivas D. |
分类号 |
C23C16/455;H01J37/32;C23C16/50 |
主分类号 |
C23C16/455 |
代理机构 |
|
代理人 |
|
主权项 |
1. A process kit, comprising:
a plate configured to be disposed in a plasma processing chamber; a plurality of apertures formed therethrough, the apertures configured to permit processing gases to flow through the plate; and an array of unit cells including at least one aperture formed in the plate, wherein each unit cell has an electrode assembly individually controllable relative to electrode assemblies disposed in at least two other unit cells. |
地址 |
Santa Clara CA US |