发明名称 FILL ON DEMAND AMPOULE REFILL
摘要 Methods and apparatus for use of a fill on demand ampoule are disclosed. The fill on demand ampoule may refill an ampoule with precursor concurrent with the performance of other deposition processes. The fill on demand may keep the level of precursor within the ampoule at a relatively constant level. The level may be calculated to result in an optimum head volume. The fill on demand may also keep the precursor at a temperature near that of an optimum precursor temperature. The fill on demand may occur during parts of the deposition process where the agitation of the precursor due to the filling of the ampoule with the precursor minimally effects the substrate deposition. Substrate throughput may be increased through the use of fill on demand.
申请公布号 US2016052655(A1) 申请公布日期 2016.02.25
申请号 US201514720595 申请日期 2015.05.22
申请人 LAM RESEARCH CORPORATION 发明人 Nguyen Tuan;Ranganathan Eashwar;Swaminathan Shankar;LaVoie Adrien;Baldasseroni Chloe;Chandrasekharan Ramesh;Pasquale Frank L.;Petraglia Jennifer L.
分类号 B65B3/04;B05C9/10;B05C9/14 主分类号 B65B3/04
代理机构 代理人
主权项 1. A method for filling an ampoule of a substrate processing apparatus comprising: (a) determining that an ampoule fill start condition for filling the ampoule with a liquid precursor is met; (b) filling the ampoule with precursor, wherein filling the ampoule with the precursor is performed concurrent with at least one other substrate processing operation; (c) reading a sensor level in the ampoule indicating that the filling is not yet complete; (d) determining that a secondary fill stop condition is met; and (e) in response to determining that the secondary fill stop condition is met, ceasing the filling of the ampoule with the precursor.
地址 FREMONT CA US