| 摘要 |
A three-dimensional monolithic memory device includes at least one device region and a plurality of contact regions each including a stack of an alternating plurality of conductive word line contact layers and insulating layers located over a substrate, where the stacks in the plurality of contact regions are separated from one another by an insulating material, and a bridge connector including a conductive material extending between a first conductive word line contact layer of a first stack in a first contact region and a second conductive word line contact layer of a second stack in a second contact region, where the first word line contact layer extends in a first contact level substantially parallel to a major surface of the substrate and the second word line contact layer extends in a second contact level substantially parallel to the major surface of the substrate that is different than the first level. |
