| 摘要 |
An encapsulation method and structure, the method comprising the following steps: step 1, providing an OLED substrate (1) and an encapsulation cover plate (4), and making alignment marks on the encapsulation cover plate (4); step 2, forming a circle of patterned dessicant layer (3) on the encapsulation cover plate (4); step 3, coating a circle of frame adhesive (5) on an outer side of the dessicant layer (3) on the encapsulation cover plate (4); step 4, laminating the encapsulation cover plate (4) and the OLED substrate (1) oppositely; step 5, irradiating with UV light or heating the frame adhesive (5) to cure the same, thus realizing encapsulation of the OLED substrate (1) with the encapsulation cover plate (4). |
