发明名称 |
SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
According to one embodiment, a semiconductor light emitting element includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type separated from the first semiconductor layer in a first direction, a light emitting layer provided between the first and second semiconductor layers, and a first intermediate unit provided between the first semiconductor layer and the light emitting layer. The light emitting layer includes a well layer including a nitride semiconductor including In. The first intermediate unit includes stacked bodies. The stacked bodies are arranged in the first direction. Each of the stacked bodies includes a first layer of Inx1Ga1-x1N, a second layer of Aly1Ga1-y1N provided between the first layer and the light emitting layer to contact the first layer, and a third layer of Aly2Ga1-y2N provided between the second layer and the light emitting layer to contact the second layer. |
申请公布号 |
US2016056329(A1) |
申请公布日期 |
2016.02.25 |
申请号 |
US201514714500 |
申请日期 |
2015.05.18 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
YOSHIDA Hisashi;Hikosaka Toshiki;Kimura Shigeya;Nago Hajime;Nunoue Shinya |
分类号 |
H01L33/06;H01L33/32;H01L33/24;H01L33/00 |
主分类号 |
H01L33/06 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor light emitting element, comprising:
a first semiconductor layer of a first conductivity type; a second semiconductor layer of a second conductivity type separated from the first semiconductor layer in a first direction; a light emitting layer provided between the first semiconductor layer and the second semiconductor layer, the light emitting layer including a well layer including a nitride semiconductor including In; and a first intermediate unit provided between the first semiconductor layer and the light emitting layer, the first intermediate unit including a plurality of stacked bodies, the stacked bodies being arranged in the first direction, each of the stacked bodies including:
a first layer of Inx1Ga1-x1N (0<x1<1);a second layer of Aly1Ga1-y1N (0<y1<1) provided between the first layer and the light emitting layer, to contact the first layer; anda third layer of Aly2Ga1-y2N (0≦y2<y1) provided between the second layer and the light emitting layer, to contact the second layer, a screw dislocation density of the first semiconductor layer being 1×108/cm2 or more. |
地址 |
Minato-ku JP |