发明名称 |
APPARATUS AND METHOD FOR PRODUCING (METAL PLATE)-(CERAMIC BOARD) LAMINATED ASSEMBLY, AND APPARATUS AND METHOD FOR PRODUCING POWER-MODULE SUBSTRATE |
摘要 |
Provided are: an apparatus and a method for producing a (metal plate)-(ceramic board) laminated assembly, a bonding material and a metal plate during the bonding of the metal plate to the ceramic board through the bonding-material layer and an apparatus and a method for producing a power-module substrate. An apparatus for producing a (metal plate)-(ceramic board) laminated assembly by laminating a metal plate having a temporary bonding material formed thereon on a ceramic board having a bonding-material layer formed thereon, the apparatus being equipped with: a conveying device which conveys the metal plate onto the ceramic board to laminate the ceramic board and the metal plate on each other; and a heating device which is arranged in the middle of a passage of the conveyance of the metal plate by the conveying device and melts the temporary-bonding material on the metal plate. |
申请公布号 |
US2016052830(A1) |
申请公布日期 |
2016.02.25 |
申请号 |
US201414780779 |
申请日期 |
2014.03.18 |
申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
OI Sotaro;KAWASAKI Takayuki |
分类号 |
C04B37/02;H01L23/373;H05K3/00;H01L21/67;H01L21/677;B23K1/00;H01L21/48 |
主分类号 |
C04B37/02 |
代理机构 |
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代理人 |
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主权项 |
1. An apparatus for producing (metal plate)-(ceramic board) laminated assembly wherein a bonding-material layer is formed on one of a ceramic board or a metal plate, temporary-bonding material is formed on one plate of the ceramic board or the metal plate, the ceramic board and the metal plate are temporarily stuck together in a piled state with the bonding-material layer therebetween by the temporary-bonding material, so that the ceramic board and the metal plate are laminated, the apparatus comprising:
a conveying device conveying the one plate of the ceramic board or the metal plate onto the other plate and laminating the ceramic board and the metal plate; and a heating device provided at a middle of a conveying path of the one plate by the conveying device and melting the temporary-bonding material on the one plate. |
地址 |
Tokyo JP |