发明名称 APPARATUS AND METHOD FOR PRODUCING (METAL PLATE)-(CERAMIC BOARD) LAMINATED ASSEMBLY, AND APPARATUS AND METHOD FOR PRODUCING POWER-MODULE SUBSTRATE
摘要 Provided are: an apparatus and a method for producing a (metal plate)-(ceramic board) laminated assembly, a bonding material and a metal plate during the bonding of the metal plate to the ceramic board through the bonding-material layer and an apparatus and a method for producing a power-module substrate. An apparatus for producing a (metal plate)-(ceramic board) laminated assembly by laminating a metal plate having a temporary bonding material formed thereon on a ceramic board having a bonding-material layer formed thereon, the apparatus being equipped with: a conveying device which conveys the metal plate onto the ceramic board to laminate the ceramic board and the metal plate on each other; and a heating device which is arranged in the middle of a passage of the conveyance of the metal plate by the conveying device and melts the temporary-bonding material on the metal plate.
申请公布号 US2016052830(A1) 申请公布日期 2016.02.25
申请号 US201414780779 申请日期 2014.03.18
申请人 MITSUBISHI MATERIALS CORPORATION 发明人 OI Sotaro;KAWASAKI Takayuki
分类号 C04B37/02;H01L23/373;H05K3/00;H01L21/67;H01L21/677;B23K1/00;H01L21/48 主分类号 C04B37/02
代理机构 代理人
主权项 1. An apparatus for producing (metal plate)-(ceramic board) laminated assembly wherein a bonding-material layer is formed on one of a ceramic board or a metal plate, temporary-bonding material is formed on one plate of the ceramic board or the metal plate, the ceramic board and the metal plate are temporarily stuck together in a piled state with the bonding-material layer therebetween by the temporary-bonding material, so that the ceramic board and the metal plate are laminated, the apparatus comprising: a conveying device conveying the one plate of the ceramic board or the metal plate onto the other plate and laminating the ceramic board and the metal plate; and a heating device provided at a middle of a conveying path of the one plate by the conveying device and melting the temporary-bonding material on the one plate.
地址 Tokyo JP