UNDERFILL DISPENSING WITH CONTROLLED FILLET PROFILE

摘要

A method includes placing an underfill-shaping cover on a package component of a package, with a device die of the package extending into an opening of the underfill-shaping cover. An underfill is dispensed into the opening of the underfill-shaping cover. The underfill fills a gap between the device die and the package component through capillary. The method further includes, with the underfill-shaping cover on the package component, curing the underfill. After the curing the underfill, the underfill-shaping cover is removed from the package.

主权项

1. An underfill-dispensing tool set for dispensing an underfill, the underfill-dispensing tool set comprising:
an underfill-dispensing boat; an underfill-shaping cover comprising:
a first through-opening; anda non-sticking material on a sidewall of the first through-opening, wherein the non-sticking material is not sticky to the underfill; a plurality of guide pins attached to a first one of the underfill-dispensing boat and the underfill-shaping cover; and a plurality of openings in a second one of the underfill-dispensing boat and the underfill-shaping cover, wherein the plurality of guide pins is configured to be inserted into the plurality of openings.