METALLIZED PARTICLE INTERCONNECT WITH SOLDER COMPONENTS

摘要

An electrical connection is established between a first electrical component and a second electrical component of an assembly and a compression tool is used to apply a compression force to the assembly. The assembly also includes a metallized particle interconnect (MPI) between the first electrical component and the second electrical component and solder components outside a boundary of the MPI and extending from the first electrical component to the second electrical component. The solder components are melted by applying heat to the assembly. The solder components are solidified by cooling the assembly and the compression tool is removed.

主权项

1. A device comprising:
a first electrical component having a top surface and a bottom surface and having an electrical contact; a second electrical component having a top surface and a bottom surface and having an electrical contact; a metallized particle interconnect (MPI) under compression between the first electrical component and the second electrical component having a top surface and a bottom surface and having conductive columns that extend from the top surface of the MPI to the bottom surface of the MPI; and a set of solder components outside a boundary of the MPI and extending from the bottom surface of the first electrical component to the top surface of the second electrical component, configured to maintain the compression of the MPI between the first electrical component and the second electrical component.