发明名称 |
CIRCUIT BOARD FORMATION USING ORGANIC SUBSTRATES |
摘要 |
A method of forming a circuit board includes forming a conductive pattern on a substrate; forming a first negative resist on the substrate after formation of the conductive pattern; partially exposing the first negative resist on the surface of the conductive pattern to form a first via exposure portion; forming a second negative resist on the substrate after formation of the first via exposure portion; partially exposing the second negative resist on the first via exposure portion to form a second via exposure portion larger than the first via exposure portion; developing the first negative resist and the second negative resist after formation of the second via exposure portion to form a via opening reaching the conductive pattern; and filling the via opening with a conductive material. |
申请公布号 |
US2016057857(A1) |
申请公布日期 |
2016.02.25 |
申请号 |
US201514817378 |
申请日期 |
2015.08.04 |
申请人 |
International Business Machines Corporation |
发明人 |
Mori Hiroyuki;Noma Hirokazu;Okamoto Keishi |
分类号 |
H05K1/03;H05K1/11;G03F7/32;G03F7/40;G03F7/16;G03F7/20 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Armonk NY US |