发明名称 |
INTEGRATED DEVICE COMPRISING A HEAT-DISSIPATION LAYER PROVIDING AN ELECTRICAL PATH FOR A GROUND SIGNAL |
摘要 |
Provided herein is an integrated device that includes a substrate, a die, a heat-dissipation layer located between the substrate and the die, and a first interconnect configured to couple the die to the heat-dissipation layer. The heat-dissipation layer may be configured to provide an electrical path for a ground signal. The first interconnect may be further configured to conduct heat from the die to the heat-dissipation layer. The integrated device may also include a second interconnect configured to couple the die to the substrate. The second interconnect may be further configured to conduct a power signal between the die and the substrate. The integrated device may also include a dielectric layer located between the heat-dissipation layer and the substrate, and a solder-resist layer located between the die and the heat-dissipation layer. |
申请公布号 |
WO2016028637(A1) |
申请公布日期 |
2016.02.25 |
申请号 |
WO2015US45288 |
申请日期 |
2015.08.14 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
SONG, YOUNG KYU;WE, HONG BOK;KIM, DONG WOOK;HWANG, KYU-PYUNG |
分类号 |
H01L23/373;H01L21/48;H01L23/498;H05K1/02 |
主分类号 |
H01L23/373 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|