发明名称 |
DIE PACKAGE COMPRISING DIE-TO-WIRE CONNECTOR AND A WIRE-TO-DIE CONNECTOR CONFIGURED TO COUPLE TO A DIE PACKAGE |
摘要 |
Some novel features pertain to an integrated device package (e.g., die package) that includes a package substrate, a die, an encapsulation layer and a first set of metal layers. The package substrate includes a first surface and a second surface. The die is coupled to the first surface of the package substrate. The encapsulation layer encapsulates the die. The first set of metal layers is coupled to a first exterior surface of the encapsulation layer. In some implementations, the first set of metal layers is configured to operate as a die-to-wire connector of the integrated device package. In some implementations, the integrated device package includes a second set of metal layers coupled to the second surface of the package substrate. In some implementations, the integrated device package includes a second set of metal layers coupled to a second exterior surface of the encapsulation layer. |
申请公布号 |
WO2015160808(A3) |
申请公布日期 |
2016.02.25 |
申请号 |
WO2015US25753 |
申请日期 |
2015.04.14 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
KIM, DAEIK DANIEL;VELEZ, MARIO FRANCISCO;KIM, JONGHAE;NOWAK, MATTHEW MICHAEL;ZUO, CHENGJIE;YUN, CHANGHAN HOBIE;BERDY, DAVID FRANCIS;MIKULKA, ROBERT PAUL |
分类号 |
H05K1/18 |
主分类号 |
H05K1/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|