发明名称 POSITIVE RELIEF FORMING OF POLYCRYSTALLINE DIAMOND STRUCTURES AND RESULTING CUTTING TOOLS
摘要 Embodiments of the invention relate to methods of making articles having portions of polycrystalline diamond bonded to a surface of a substrate and polycrystalline diamond compacts made using the same. In an embodiment, a molding technique is disclosed for forming cutting tools comprising polycrystalline diamond portions bonded to the outer surface of a substrate.
申请公布号 WO2016028788(A1) 申请公布日期 2016.02.25
申请号 WO2015US45704 申请日期 2015.08.18
申请人 US SYNTHETIC CORPORATION 发明人 MIESS, DAVID P.
分类号 C01B31/06;B01J3/04;B01J6/00;E21B10/46 主分类号 C01B31/06
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