| 摘要 |
The embodiment of the present invention provides an apparatus and a method for treating a substrate. The apparatus includes a substrate support unit which supports a substrate, a vision unit which photographs a mounted state of the substrate supported by the substrate support unit, and a controller which controls the substrate support unit and the vision unit, and compares capture data transmitted from the vision unit with pre-input reference data to determine the mounted state of the substrate. The substrate support unit includes a support plate, a plurality of chuck pins which surround a central axis of the support plate and support the different lateral regions of the substrate, and a driving member which rotates the support plate. The vision unit photographs the lateral region of the substrate and the chuck pin. Therefore, the mounted state of the substrate can be detected by the shape and the position of the chuck pin which supports the lateral part of the substrate. |
