| 摘要 |
PURPOSE: A thermosetting resin composition is provided to improve the adhesion between a package component and a mounting substrate by using heat generated from a reflow process. CONSTITUTION: A thermosetting resin composition (31) contains an epoxy resin, an organic acid and a thixotropic agent. The epoxy resin contains a dimer acid type epoxy resin. The thermosetting resin composition also contains an epoxy hardener. The thermosetting resin composition also contains a monofunctional glycidyl radical containing compound. The viscosity of the thermosetting resin compositions at the temperature of 40°C is 20 to 3000 Pa·s. |
