| 摘要 |
The present invention prevents bumps on semiconductor chips from sticking to probe needles and coming off from the semiconductor chips. A wafer has effective areas where a plurality of bumps (first bumps) are formed. The bumps are formed on the side of an active surface of the semiconductor chips. The wafer further has non-effective areas where a plurality of dummy bumps are formed. Among the dummy bumps, some positioned at the outermost circumference are dummy bumps (second bumps) that are smaller than the other bumps. The dummy bumps (second bumps) intersect the inner peripheral edge of a shielding member as viewed in a plan view. The dummy bumps (second bumps) are formed over third pad electrodes. A bump-formation insulating film is removed from over the entire third pad electrodes. |
