| 摘要 |
The invention relates to a method of mounting a semiconductor device. Pressurizing and heating are conducted while spraying reducing gas (21) to conduct bump jointing. A plurality of semiconductor elements are arranged on the surface of a substrate (2), and all pressurized heavy substances (22) are divided, and thereby flowing path of the reducing gas (21) can be ensured, gap between a bump (4) and an electrode terminal can be inhibited, and warping at the time of bump jointing can be prevented. |
