发明名称 |
APPARATUS AND METHODS FOR MINIMIZING ARCING IN A PLASMA PROCESSING CHAMBER |
摘要 |
A plasma processing chamber for processing a substrate to form electronic components thereon is disclosed. The plasma processing chamber includes a plasma-facing component having a plasma-facing surface oriented toward a plasma in the plasma processing chamber during processing of the substrate, the plasma-facing component being electrically isolated from a ground terminal. The plasma processing chamber further includes a grounding arrangement coupled to the plasma-facing component, the grounding arrangement including a first resistance circuit disposed in a first current path between the plasma-facing component and the ground terminal. The grounding arrangement further includes a RF filter arrangement disposed in at least one other current path between the plasma-facing component and the ground terminal, wherein a resistance value of the first resistance circuit is selected to substantially eliminate arcing between the plasma and the plasma-facing component during the processing of the substrate. |
申请公布号 |
EP1509942(B1) |
申请公布日期 |
2016.02.24 |
申请号 |
EP20030726570 |
申请日期 |
2003.05.01 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
HOWALD, ARTHUR, M.;KUTHI, ANDRAS;BAILEY, ANDREW, D., III;BERNEY, BUTCH |
分类号 |
H01J37/32;H05H1/46;C23C16/00;C23C16/50;H01L21/205;H01L21/306;H01L21/3065;H05H1/00 |
主分类号 |
H01J37/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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