| 摘要 |
The present invention is to provide a variable wire-saw device capable of improving the flatness of a cut surface in correspondence with the size of an object to be processed. The variable wire-saw device according to the present invention to cut and process an ingot by using a wire comprises: a holder to which the ingot is bonded; a wire supply bobbin around which the wire is wound; a wire winding bobbin around which the wire supplied from the wire supply bobbin is wound; multiple guide rollers which are disposed between the wire supply bobbin and the wire winding bobbin, and around which the wire is wound, so as to induce the wire; a slurry supply rod which supplies a slurry solution to the wire; a motor which is connected to one or more of the guide rollers to rotate the guide rollers; and a support block which fixes and supports the holder, wherein the guide rollers are variable in position. |
